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    Advanced Manual Probers Solutions - SEMISHARE Prober

    Embark on a journey of semiconductor testing finesse with our manual prober collection. Dive into SEMISHARE Prober's unique manual prober solutions for precision.

    SEMISHARE: Pioneering Manual Prober Technology in Semiconductor Testing

    In the intricate world of semiconductor testing, precision and reliability are paramount. SEMISHARE's H Series Integrated Manual Probe Station stands at the forefront of manual prober technology, offering unparalleled performance for a wide range of semiconductor testing applications. This article delves into the nuances of manual probers, their critical role in semiconductor development, and the innovative features that set SEMISHARE's technology apart.

    Understanding the Manual Prober

    A manual prober, the cornerstone of semiconductor testing in many research and development settings, is a sophisticated device designed for hands-on electrical testing of semiconductor wafers and chips. Unlike automated systems, a manual prober allows for direct user control, making it invaluable for detailed analysis and specialized testing scenarios.

    Key Components of a Manual Prober:

    1. Probe Platen: The platform where probe positioners are mounted.

    2. Chuck: A specialized stage that holds the wafer or device under test.

    3. Microscope: For visual inspection and precise probe placement.

    4. Probe Positioners: Mechanical arms for precise probe movement.

    5. Vibration Isolation System: To minimize external disturbances.

    SEMISHARE's H Series manual prober integrates these components with advanced technologies, creating a system that excels in precision, stability, and user-friendliness.

    The Evolution of Manual Prober Technology

    Manual probers have come a long way since their inception. Early models were basic mechanical devices with limited precision. Today's manual probers, like SEMISHARE's H Series, incorporate advanced materials, precision engineering, and sophisticated control systems.

    Key advancements in manual prober technology include:

    1. Improved Positioning Accuracy: From millimeter to sub-micron precision.

    2. Enhanced Vibration Isolation: Using active and passive damping systems.

    3. Integration of Digital Imaging: For real-time visual feedback.

    4. Advanced Chuck Technologies: Including thermal control and air-bearing systems.

    5. Software Integration: For data collection, analysis, and process automation.

    SEMISHARE's Innovations in Manual Prober Design

    Chuck Air Bearing Move Technology

    This groundbreaking feature in SEMISHARE's manual prober revolutionizes wafer handling:

    1. Frictionless Movement: Allows for smooth, precise wafer positioning.

    2. Reduced Contamination: Minimizes particle generation during movement.

    3. Enhanced Throughput: Enables faster repositioning between test points.

    4. Improved Accuracy: Eliminates stick-slip effects common in mechanical systems.

    The air bearing system uses a thin film of pressurized air to float the chuck, reducing friction to near-zero levels. This not only improves positioning accuracy but also extends the life of the chuck mechanism.

    Large Handle Differential Head Drive

    This ergonomic innovation significantly enhances user experience and precision:

    1. Intuitive Control: Large handles provide better tactile feedback.

    2. Fine Adjustment: Differential mechanism allows for micrometer-level adjustments.

    3. Reduced Operator Fatigue: Ergonomic design for extended use.

    4. Increased Stability: Minimizes unintended movements during adjustment.

    The differential head drive combines coarse and fine adjustment capabilities, allowing operators to make precise movements with ease. This is particularly crucial when working with dense semiconductor layouts.

    Microscope Air-Controlled Lifting Control

    This feature enhances both functionality and safety:

    1. Smooth Vertical Movement: Precision air control for focus adjustments.

    2. Collision Prevention: Automated safeguards to prevent accidental contact.

    3. Extended Working Distance: Facilitates easier wafer and probe manipulation.

    4. Rapid Objective Changes: Streamlines workflow for different magnification needs.

    The air-controlled system provides a level of control and safety not possible with manual lifting mechanisms, ensuring the delicate balance between close observation and wafer protection.

    Three-Stage Lifting Needle Base Platform

    This advanced system offers unparalleled flexibility in probe positioning:

    1. Rapid Height Adjustment: Quick transitions between test, separation, and loading positions.

    2. Micrometer-Level Precision: Fine control for exact probe placement.

    3. Consistent Repeatability: Ensures reliable results across multiple tests.

    4. Enhanced Safety Features: Incorporates locks to prevent accidental movements.

    The three-stage system allows for both rapid gross adjustments and ultra-fine positioning, catering to a wide range of testing scenarios.

    Applications of Manual Probers in Modern Semiconductor Testing

    Manual probers find applications across various sectors of the semiconductor industry:

    1. Research and Development

    - New Material Characterization: Testing electrical properties of novel semiconductor materials.

    - Device Prototyping: Evaluating performance of experimental chip designs.

    - Failure Analysis: Identifying and analyzing defects in semiconductor devices.

    2. Low-Volume Production

    - Custom IC Testing: For specialized or small-batch integrated circuits.

    - MEMS Device Evaluation: Testing micro-electromechanical systems.

    - Photonic Device Characterization: Analyzing optoelectronic components.

    3. Educational Institutions

    - Hands-on Training: Teaching semiconductor testing principles to students.

    - Academic Research: Supporting cutting-edge studies in microelectronics.

    4. Quality Control

    - Spot-Checking: Verifying the quality of production batches.

    - Process Validation: Ensuring manufacturing processes meet specifications.

    5. Specialized Testing Environments

    - High/Low Temperature Testing: Evaluating device performance under extreme conditions.

    - High-Frequency Testing: Characterizing RF and microwave devices.

    - High-Power Device Testing: Assessing performance of power semiconductors.

    SEMISHARE's manual prober excels in these applications, offering the flexibility and precision needed for diverse testing requirements.

    The Role of Software in Manual Prober Operations

    While the physical components of a manual prober are crucial, the software interface plays an equally important role:

    1. Test Pattern Generation: Creating custom test sequences for specific devices.

    2. Data Acquisition and Analysis: Collecting and processing test results in real-time.

    3. Probe Positioning Control: Assisting in precise probe placement and movement.

    4. Environmental Monitoring: Tracking and controlling test conditions.

    5. Integration with External Instruments: Coordinating with other test equipment.

    SEMISHARE's prober software is designed for intuitive operation while offering advanced capabilities for data management and analysis.

    As semiconductor technology continues to advance, manual probers are evolving to meet new challenges:

    1. Increased Automation: Integration of automated features for repetitive tasks.

    2. Enhanced Resolution: Pushing the boundaries of probe positioning accuracy.

    3. Advanced Materials: Incorporating new materials for improved performance and durability.

    4. IoT Integration: Connecting probers to the broader manufacturing ecosystem.

    5. AI-Assisted Testing: Implementing machine learning for test optimization and fault detection.

    SEMISHARE is at the forefront of these developments, continuously refining its manual prober technology to meet the evolving needs of the semiconductor industry.

    In the rapidly evolving field of semiconductor technology, the role of precise and reliable testing equipment is more critical than ever. SEMISHARE's H Series Integrated Manual Probe Station represents the pinnacle of manual prober technology, offering unparalleled precision, versatility, and user-friendliness.

    From its innovative Chuck Air Bearing Move Technology to its ergonomic Large Handle Differential Head Drive, every aspect of SEMISHARE's manual prober is designed to enhance the testing process. Whether used in cutting-edge research laboratories, educational institutions, or specialized production environments, this manual prober provides the tools necessary to push the boundaries of semiconductor technology.

    As the semiconductor industry continues to advance, with devices becoming smaller, more complex, and more powerful, the need for sophisticated testing equipment grows. SEMISHARE's commitment to innovation ensures that its manual prober technology evolves in tandem with these industry developments, providing researchers and engineers with the tools they need to shape the future of electronics.

    For those seeking to elevate their semiconductor testing capabilities, SEMISHARE's manual prober offers a compelling solution. Its combination of precision, flexibility, and advanced features makes it an indispensable tool in the quest for semiconductor innovation and quality assurance.

    To learn more about how SEMISHARE's manual prober can enhance your semiconductor testing processes, visit our website at https://www.semishareprober.com/. Discover the difference that precision, reliability, and innovation can make in your semiconductor testing endeavors.

    Produktübersicht Funktionsstruktur Technische Spezifikationen Downloads Video
    H-Serie Manuelle Universelle Probestation

    Product Overview

    Die H-Serie Probestation bietet hervorragende mechanische Leistung und Testfunktionen. Ihre Spannvorrichtung-Bewegungstechnologie erfüllt Anforderungen für effiziente Wafer-Tests und basiert auf einem modularen, offenen UPStart™-Design. Mit unterschiedlichen Kits kann die H-Serie für eine Vielzahl von Testanforderungen angepasst werden. Die H-Serie ist in Varianten für 6", 8" und 12" erhältlich und eignet sich hervorragend für einmalige Anschaffungen in Forschungs-und Entwicklungslaboren.

    Basisinformationen

    Produktnummer H6/H8/H12 Arbeitsumgebung Open type
    Stromanforderungen 220V,50~60Hz Steuerungsmodus Manual Probe Station
    Produktabmessungen 1300MM long *920MM wide *920MM high Gerätegewicht About 300 kg

    Anwendungsbereich

    DC-/IV-/CV-Tests, Niedrigstromtests (100 fA), 1/f-Rauschtests, Fehleranalysen, Bauteilcharakterisierung, WLR-Zuverlässigkeits- und Alterungstests, RF-Tests, Hochstrom-/Hochspannungstests

    Technische Merkmale

    >Pneumatische Spannvorrichtungs-Bewegungstechnologie (Chuck Air bearing move)

    Die luftgesteuerte Plattform bietet eine schnelle Spannvorrichtung-Bewegungsfunktion und erfüllt die Anforderungen für effiziente manuelle Tests. Über entsprechende Luftlager-Schalter werden drei Arten der schnellen Bewegung ermöglicht: Einhändige Steuerung für schnelle Bewegung in X/Y-Richtung, beidhändige Steuerung für schnelle Bewegung der gesamten Probeplattform. Traditionelle Probenplattformen mit Kugel-/Lagervorrichtungen ermöglichen nur unidirektionale Bewegungen entlang der X/Y-Achse und weisen eine langsame Bewegungsgeschwindigkeit auf. Normale luftgelagerte Probenplattformen ermöglichen zwar schnelle Bewegungen über die gesamte Plattformfläche, jedoch keine präzise unidirektionale Positionierung entlang der X-/Y-Achse, was den Anforderungen der Produktion nicht gerecht wird. Die dreifache luftgesteuerte Probenplattform kombiniert und realisiert perfekt die oben genannten Funktionen.

    >Großer Handgriff-Mikrometerschraubenantrieb

    Die Plattform für die Spannvorrichtung-Bewegung ist mit Grob- und Feineinstellungsfunktionen ausgestattet. Im Vergleich zu traditionellen kleinen Mikrometerschrauben bietet sie ein komfortableres Bediengefühl, eine reibungslosere Anpassung und keine Rückkehrabweichung, was eine extrem sanfte manuelle Hochleistungstestung ermöglicht. Dies steigert die Testeffizienz und reduziert die Testkosten für den Kunden erheblich.

    >Luftgesteuerte Höhenverstellung des Mikroskops

    Das Mikroskop kann durch eine luftgesteuerte Verstellung um 50 mm angehoben werden. Durch die Steuerung mit hochwertigen Ventilen und die präzise Drosselung des Hochdruckluftstroms wird eine stabile Höhenverstellung ermöglicht. Dies erleichtert den Objektivwechsel und schützt Objektive sowie Spannvorrichtungen vor versehentlichen Beschädigungen während des Tests.

    > Dreistufige Hubplattform für Nadelhalter

    Die Hubplattform für Nadelhalter bietet schnelle Hubbewegungen (0, 300 µm, 3 mm) und Feineinstellungen (40 mm, Bewegungsauflösung 2-5 µm). Alle Teile der Plattform können gleichzeitig angehoben werden, ohne dass es zu zeitlichen Abweichungen kommt. Nach dem Anheben und Absenken weist die Nadelspitze auf dem Pad in den Richtungen x, y und z eine Wiederholgenauigkeit von besser als ±1 µm auf. Die wiederholbare (1 µm) Hubplattform für Nadelhalter verfügt über drei diskrete Positionen für Kontakt, Trennung (300 µm) und Laden (3 mm). Sie ist mit einer Sicherheitsverriegelung ausgestattet, die unbeabsichtigte Schäden an Nadelspitzen oder Wafern verhindert und gleichzeitig intuitive Kontrolle und präzise Kontaktpositionierung bietet.

    > Lasermodul nachrüstbar

    Das Mehrwellenband-Laserschneidsystem kann an den meisten in der Fehleranalyse verwendeten Mikroskopen installiert werden. Es ermöglicht präzises Schneiden auf mikroskopischer Ebene und selektive Materialentfernung. Das präzise und zuverlässige fortschrittliche Laserübertragungssystem (ABDS) erlaubt die Auswahl verschiedener Wellenlängen für unterschiedliche Materialien bei Schneid- und Schnittarbeiten. Maximale Laserleistungsausgabe ≥2,7 mJ, einstellbare Energieniveaus ≥300. Die wassergekühlte Struktur sorgt für ein kompakteres System und wartungsfreien Betrieb.

    Title

    H series
    Specification
    Model H6 H8 H12
    Dimension L: 820mm*
    W: 720mm*
    H: 890mm
    L: 960mm*
    W: 850mm*
    H: 900mm
    L: 1300mm*
    W: 920mm*
    H: 920mm
    Weight (about) 170KG 230KG 300KG
    Electricity Demand 220VC, 50~60Hz
    Chuck Size & Rotation angle 6", 360° Rotation 8", 360° Rotation 12", 360° Rotation
    X-Y Travel range 6" * 6" 8" * 8" 12" * 12"
    Moving resolution 1μm
    Sample fixed mode Vacuum adsorption
    Electrical design Electrical Floating with Banana plug adapter, can be used as a backside electrode
    Platen U shape platen 6 micropositioners available 8 micropositioners available 12 micropositioners available
    Move range & adjustment mode Platen can be quickly lifted up and down 6mm for fast probe tip seperation
    Platen can be fine tuned up and down 25mm precisely with 1μm resolution
    Microscope Travel range X-Y axis : 2" * 2",  Z axis : 50.8mm
    Moving resolution 1μm
    Switching object lens Microscope tilting 30°manually by Lever
    Magnification 20~4000X
    Lens specification Eyepiece: 10X ; Objective lens : 5X, 10X, 20X, 50X 100Xoption
    CCD pixels 50W (Analog) / 200W (Digital) / 500W (Digital)
    Micropositioner specification X-Y-Z Travel range 12mm-12mm-12mm / 8mm-8mm-8mm
    Mechanical resolution 10μm / 2μm / 0.7μm / 0.1μm
    Current leakage accuracy
    Coaxial 1pA/V @ 25 ℃; Three shaft 100fA/V @ 25 ℃; Triaxial 10pA@3kv @25°C,Test conditions: dry environment for grounding shield (air dew point lower than - 40 ° C)
    Cable connectors Banana head / Crocodile clip /  Coaxial / Triaxial
    Application

    Wafer test, Photoelectric device test, PCB / IC test, RF test,  high voltage and high

    current measurement etc.

    Optional Accessories Chuck quick roll out mechanism
    Microscope tilt mechanism (Tilting 30° manually by Lever )
    Microscope pneumatic lifting mechanism
    Laser repair with cutting,ablation and welding function
    Probe clamp
    Dark field of microscope / DIC / Normarski test, Light intensity / wavelength test
    IC hotspot detection by LC
    High voltage and high current measurement
    Hot chuck
    High/Low temprature chuck
    Shielding box
    Special adapter
    Vibration free table
    Gold-plated chuck
    Coaxial / Triaxial chuck
    Chuck quick move-out and fine adjustment mechanism
    Chuck rotation fine adjustment
    Light intensity / wavelength testing
    RF Testing
    Active probe
    Low current / Capacitance test
    Intergartion of intergral sphere
    Fixture for Fibre optic coupler test
    Fixture of Package IC test
    Fixture of PCB test
    Special Custom design
    Characteristics
    Stable structure, Platen can be quick lifted and fine-tuned, Suitable
    for probe card installation and usage
    Comfortable large handle, Driver Screws: Zero back lash
    Compatible with high magnification metallographic microscope Internal circuit/ electrode/ PAD probe
    Suitable in University and Research laboratory LD/LED/PD Light intensity / wavelength testing
    Up to 12 inch wafer testing IV/CV Characteristic testing of materials / devices
    High precision lead screw drive structure, linear movement

    High frequency characteristic test of devices

    (up to 300GHz frequency)



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