Our website uses cookies provided by us and third parties. Some cookies are necessary for the operation of the website, and you can adjust other cookies at any time, especially those that help us understand the performance of the website, provide you。

I accept
Name:
Phone Number*
Company Name:
mailbox*
Country*
Content:

Company

News

News

Semiconductor Wafer Prober Testing | RF Test Probes | SEMISHARE

SEMISHARE's cutting-edge semiconductor wafer prober testing solutions and RF test probes are transforming on-wafer testing. Learn about our latest advancements.

SEMISHARE: Pioneering Advanced Semiconductor Testing Solutions

In the rapidly evolving landscape of semiconductor technology, the importance of precise and reliable testing cannot be overstated. As the industry pushes the boundaries of performance and miniaturization, the need for advanced probe test solutions and sophisticated on wafer testing methodologies has become more critical than ever. SEMISHARE, a leading innovator in semiconductor test equipment, stands at the forefront of this technological revolution, offering cutting-edge test probes, rf test probes, and comprehensive semiconductor test probes that are reshaping the landscape of wafer testing.

Understanding the Fundamentals of Probe Testing

Probe test technology is at the heart of semiconductor manufacturing and validation processes. A test probe serves as the critical interface between test equipment and the device under test (DUT), allowing for precise measurement of electrical characteristics and performance parameters. SEMISHARE's advanced test probe solutions are designed to meet the exacting demands of modern semiconductor testing, offering unparalleled accuracy, reliability, and versatility across a wide range of applications.

How does a test probe work?

A test probe establishes a secure electrical connection with the DUT, typically through direct contact with test pads or bumps on the wafer surface. The probe transmits electrical signals to the device and measures the resulting responses, enabling engineers to evaluate various aspects of the semiconductor's performance, including voltage, current, resistance, and frequency response.

Types of Test Probes

SEMISHARE offers a comprehensive range of test probes to address diverse testing requirements:

1. DC Probes: Used for measuring static electrical properties and low-frequency signals.

2. AC Probes: Designed for testing alternating current characteristics and dynamic behavior.

3. RF Test Probes: Specialized probes for high-frequency and radio frequency measurements.

4. Semiconductor Test Probes: Custom-designed probes for specific semiconductor device testing requirements.

Accepted Methods for Probe Testing

The semiconductor industry relies on several established probe test methodologies:

1. DC Parametric Testing: Measuring static electrical properties such as resistance, voltage thresholds, and leakage currents.

2. AC Characterization: Evaluating dynamic behavior and frequency response of devices.

3. RF Performance Testing: Assessing high-frequency characteristics crucial for wireless and communication applications.

4. Functional Testing: Verifying the overall functionality and performance of the device under various operating conditions.

Advancing RF Wafer Probe Technology

As the demand for high-frequency devices continues to grow, the importance of advanced rf wafer probe technology cannot be overstated. SEMISHARE has been at the forefront of developing cutting-edge rf wafer probe solutions that address the unique challenges posed by radio frequency testing on semiconductor wafers.

Our rf wafer probe systems are designed to provide accurate and reliable measurements across a wide range of frequencies, from sub-GHz to mmWave. The precision-engineered probe tips ensure optimal contact with the device under test, minimizing parasitic effects and maintaining signal integrity throughout the measurement process.

Key features of SEMISHARE's rf wafer probe technology include:

1. Wide bandwidth capability: Our rf wafer probe solutions support measurements up to 120 GHz and beyond, making them ideal for next-generation wireless and 5G applications.

2. Low insertion loss: Advanced materials and design techniques minimize signal attenuation, ensuring accurate measurements even at the highest frequencies.

3. Customizable probe configurations: We offer a range of rf wafer probe options to accommodate various device layouts and pad geometries.

4. Integration with automated test systems: Our rf wafer probe solutions can be seamlessly integrated with automated wafer probers for high-volume testing.

5. Temperature-controlled testing: Many of our rf wafer probe systems include options for heated or cooled chucks, enabling device characterization across a wide temperature range.

The use of advanced rf wafer probe technology is critical in the development and production of high-frequency semiconductor devices. By providing accurate on-wafer measurements, SEMISHARE's rf wafer probe solutions help engineers optimize device performance, reduce design cycles, and improve overall product quality.

Enhancing Semiconductor Test Probes for Next-Generation Devices

As semiconductor devices continue to shrink in size and increase in complexity, the demands placed on semiconductor test probes have grown exponentially. SEMISHARE's advanced semiconductor test probes are designed to meet these challenges head-on, offering unparalleled precision and reliability in wafer-level testing.

Our semiconductor test probes are engineered to address the specific needs of various device types, including:

1. Logic and memory devices

2. Analog and mixed-signal ICs

3. RF and microwave components

4. Power semiconductors

5. MEMS and sensors

Key innovations in SEMISHARE's semiconductor test probes include:

1. Ultra-fine pitch capability: Our advanced probe technologies can accommodate pad pitches down to 30 microns and below, enabling testing of the most densely packed chips.

2. Multi-DUT testing: Many of our semiconductor test probes are designed for parallel testing of multiple devices, significantly increasing throughput and reducing overall test time.

3. High-frequency performance: Specialized semiconductor test probes for RF and microwave applications maintain signal integrity up to mmWave frequencies.

4. Robust design: Our semiconductor test probes are built to withstand millions of touchdowns, ensuring long-term reliability and reduced maintenance costs.

5. Customizable tip geometries: We offer a wide range of probe tip shapes and materials to optimize contact resistance and minimize pad damage.

By continually advancing our semiconductor test probe technology, SEMISHARE enables our customers to stay ahead of the curve in semiconductor testing, ensuring that they can accurately characterize and validate even the most advanced devices.

Revolutionizing On Wafer Testing Methodologies

On wafer testing has become an indispensable part of the semiconductor manufacturing process, allowing for early detection of defects and comprehensive device characterization before packaging. SEMISHARE's advanced on wafer testing solutions are designed to maximize efficiency, accuracy, and flexibility in this critical phase of production.

Our on wafer testing systems incorporate several key technologies:

1. High-precision probe positioning: Automated systems ensure accurate and repeatable probe placement across the wafer, with positioning resolution down to sub-micron levels.

2. Advanced chuck technologies: Temperature-controlled chucks enable device testing across a wide range of operating conditions, from cryogenic temperatures to over 300°C.

3. Integrated measurement capabilities: Our on wafer testing solutions seamlessly interface with a variety of test and measurement equipment, including network analyzers, parametric testers, and high-speed digital test systems.

4. Automated pattern recognition: Advanced imaging and pattern recognition algorithms facilitate rapid die identification and probe alignment, reducing overall test time.

5. Flexible probe card compatibility: Our on wafer testing systems support a wide range of probe card technologies, including vertical, cantilever, and MEMS-based designs.

SEMISHARE's commitment to advancing on wafer testing methodologies extends beyond hardware innovations. We also provide comprehensive software solutions that streamline test program development, data analysis, and results reporting. This integrated approach to on wafer testing helps our customers:

1. Reduce time-to-market for new semiconductor products

2. Improve overall yield through early defect detection

3. Optimize device performance through comprehensive characterization

4. Lower testing costs through increased efficiency and automation

Semiconductor Wafer Prober: The Foundation of Efficient Testing

At the heart of any advanced wafer testing setup lies the semiconductor wafer prober. SEMISHARE's state-of-the-art semiconductor wafer prober systems represent the culmination of years of research and development in precision mechanics, automation, and test integration.

Our semiconductor wafer prober solutions offer:

1. High-speed wafer handling: Automated wafer loading and unloading systems minimize handling time and reduce the risk of wafer damage.

2. Precision stage control: Advanced motion control systems provide sub-micron positioning accuracy, ensuring precise probe placement even on the smallest pad sizes.

3. Flexible chuck options: We offer a range of chuck technologies to suit various testing needs, including thermal chucks for temperature-dependent measurements and vacuum chucks for secure wafer holding.

4. Integrated vision systems: High-resolution cameras and advanced image processing algorithms facilitate rapid wafer alignment and probe positioning.

5. Modular design: Our semiconductor wafer prober systems can be easily configured and upgraded to accommodate changing test requirements and new device technologies.

6. Environmental control: Many of our semiconductor wafer prober models include options for EMI shielding and vibration isolation, ensuring optimal measurement conditions.

7. Seamless software integration: SEMISHARE's prober control software interfaces with a wide range of test equipment and automation platforms, enabling smooth integration into existing test workflows.

The Role of Semiconductor Wafer Probers in Advanced Packaging

As advanced packaging technologies like 2.5D and 3D IC become more prevalent, the role of the semiconductor wafer prober in testing these complex structures has expanded. SEMISHARE's advanced semiconductor wafer prober systems are designed to address the unique challenges posed by these new packaging paradigms, including:

1. Testing of high-density interposers

2. Probing of through-silicon vias (TSVs)

3. Known-good-die (KGD) testing for stacked die applications

4. Fine-pitch micro-bump probing for flip-chip devices

By continually innovating our semiconductor wafer prober technology, SEMISHARE ensures that our customers are well-equipped to handle the testing challenges of both current and future semiconductor devices.

Advancing Probe Test Methodologies

At SEMISHARE, we continuously strive to enhance our probe test capabilities to meet the evolving needs of the semiconductor industry. Our advanced probe test solutions are designed to address the challenges of testing increasingly complex and miniaturized devices. By leveraging cutting-edge technologies and innovative approaches, we've developed probe test systems that offer unparalleled accuracy, speed, and reliability.

One of the key areas where our probe test technology shines is in the testing of high-speed digital circuits. Our probe test solutions incorporate advanced signal integrity techniques to ensure accurate measurements even at the highest data rates. This capability is crucial for validating the performance of next-generation communication chips and high-speed memory devices.

Moreover, our probe test systems are equipped with intelligent automation features that streamline the testing process and reduce the potential for human error. These automated probe test routines can significantly increase throughput while maintaining the highest standards of measurement accuracy.

SEMISHARE's probe test solutions also excel in the realm of power semiconductor testing. Our specialized probe test setups can handle high voltages and currents, allowing for comprehensive characterization of power devices such as IGBTs, MOSFETs, and wide-bandgap semiconductors like SiC and GaN.

Innovations in RF Test Probes

The field of RF testing is experiencing rapid growth, driven by the proliferation of wireless technologies and the advent of 5G networks. To meet these challenges, SEMISHARE has made significant investments in developing state-of-the-art rf test probes.

Our latest generation of rf test probes incorporates advanced materials and precision manufacturing techniques to achieve superior high-frequency performance. These rf test probes maintain excellent signal integrity up to mmWave frequencies, making them ideal for testing cutting-edge 5G and beyond-5G devices.

SEMISHARE's rf test probes are designed with versatility in mind. They can be easily integrated into various test setups, from manual probe stations to fully automated wafer-level test systems. This flexibility allows our customers to leverage the same high-performance rf test probes across different stages of their product development and manufacturing processes.

To complement our rf test probes, we've also developed a suite of calibration and de-embedding tools. These software solutions help engineers extract accurate device characteristics from raw measurement data, accounting for the effects of the rf test probes and associated fixtures.

Furthermore, our rf test probes are compatible with a wide range of RF and microwave measurement equipment, including vector network analyzers, spectrum analyzers, and signal generators. This broad compatibility ensures that our rf test probes can seamlessly integrate into existing test environments, maximizing the value of our customers' equipment investments.

In response to the growing demand for over-the-air (OTA) testing of 5G devices, SEMISHARE has also introduced specialized rf test probes designed for near-field probing of antennas and antenna arrays. These rf test probes enable detailed characterization of antenna radiation patterns and help optimize the performance of complex multi-antenna systems.

By continually pushing the boundaries of rf test probe technology, SEMISHARE ensures that our customers have the tools they need to stay competitive in the rapidly evolving world of RF and wireless communications.

SEMISHARE's Commitment to Innovation in Wafer Testing

At SEMISHARE, we understand that the future of semiconductor technology relies on continuous innovation in testing methodologies. Our commitment to advancing wafer testing capabilities is evident in our ongoing research and development efforts:

1. Advanced Materials: Developing probe tips with novel materials for enhanced durability and electrical performance.

2. Intelligent Testing Algorithms: Implementing AI-driven test optimization to reduce test times and improve coverage.

3. Integrated Measurement Solutions: Creating seamless interfaces between probe systems and advanced measurement equipment.

The SEMISHARE Advantage in Semiconductor Testing

Choosing SEMISHARE as your partner in semiconductor testing offers numerous advantages:

1. Comprehensive Solutions: From individual test probes to fully integrated wafer testing systems, SEMISHARE provides end-to-end solutions for semiconductor characterization.

2. Customization Capabilities: Our team of experts works closely with clients to develop tailored testing solutions for unique device requirements.

3. Global Support Network: With a worldwide presence, SEMISHARE offers local support and rapid response times to meet your testing needs.

4. Continuous Innovation: Our commitment to research and development ensures that our clients always have access to the latest advancements in probe test technology.

Conclusion: Empowering the Future of Semiconductor Innovation

As the semiconductor industry continues to evolve, the importance of advanced test solutions cannot be overstated. SEMISHARE's comprehensive suite of rf wafer probe, semiconductor test probes, on wafer testing, and semiconductor wafer prober technologies empowers our customers to stay at the forefront of semiconductor innovation.

Our commitment to ongoing research and development ensures that we continue to push the boundaries of what's possible in semiconductor testing. By partnering with SEMISHARE, semiconductor manufacturers and researchers gain access to:

1. Cutting-edge rf wafer probe solutions for high-frequency device characterization

2. Advanced semiconductor test probes capable of testing the most complex and densely packed chips

3. Comprehensive on wafer testing methodologies that improve yield and reduce time-to-market

4. State-of-the-art semiconductor wafer prober systems that form the foundation of efficient and accurate testing

As we look to the future, SEMISHARE remains dedicated to advancing the field of semiconductor test technology. Our ongoing investments in areas such as artificial intelligence, machine learning, and advanced materials promise to unlock new possibilities in device characterization and testing efficiency.

For more information on how SEMISHARE's advanced semiconductor test solutions can empower your research or production processes, visit our website at https://www.semishareprober.com/. Discover how our expertise in rf wafer probe technology, semiconductor test probes, on wafer testing methodologies, and semiconductor wafer prober systems can help you achieve new heights in semiconductor innovation and manufacturing excellence.

 

Advanced wafer probe technology helps semiconductor industry application development

Release time:2020-08-27Source: SEMISHARE


Advances in science and technology, such as 5 g communications, aerospace unmanned artificial intelligence technology in the field of large data such as core boundary in constant innovation and breakthrough, with chip as the core and iteration time and updated in product technology, to satisfy the criteria for higher performance requirements, wafer level testing has become increasingly important, from the lab to the fabs in chip research and development of the whole production process, to speed up the product process and improve product yield is particularly critical.


For years, society, through continuous technological innovation to promote, together with the customer to meet the challenges in the key technology of semiconductor process, collaborative customer made in the process of chip development and production technology optimization and performance improvement, in the field of prober, society, not only provide a prober, provide more advanced wafer probe technology, focus on how to quickly from the surface of the wafer to precision instrument more stable signal, to achieve more accurate reliability test, and ultimately help customers quickly achieve technology.


Advanced wafer probe technology helps semiconductor industry application development


01

Chuck Air bearing move™ technology

High - Performance technology provides a wafer can be easily move quickly and firmly lock the wafer testing displacement device and wafer testing machine is used by the base set a surface seal area, seating area and set up a relatively smooth plane form sealed cavity, and Settings can generate High pressure and low pressure gas generator, the sealing area, connected in produce High pressure gas, High pressure gas buoyancy make samples bearing structure is easy to move;When the low-pressure gas is generated, the vacuum suction generated by the low-pressure gas makes the sample bearing structure firmly fixed, which can easily and quickly move the wafer and firmly lock it.



Application direction: WAFER I-V/C-V test RF/mmW test MEMS Hall test HIGH voltage/high current test LD/LED/PD Test PCB/ package device test chip internal circuit/electrode /PAD test, etc.


H series is a high-end comprehensive manual test probe configuration, the device has excellent stability and maneuverability, high test precision, better than the rest of the industry prober unique pneumatic chuck mobile technology flexible UPStart modular structure design of three needle lift platform to enhance sexual shockproof system, at the same time late device can support scalable, loadable laser repair kits, meet the demand of customers a variety of testing applications, truly achieve more than one application.

02

SpecialConditions™ technology

The test probe table and test method for semiconductor devices provided by SpecialConditions can effectively create an integrated high-temperature and low-temperature vacuum and other test environment by setting up a vacuum cavity radiation-proof screen and other structures, which can provide a stable test environment for the semiconductor devices produced.



Application: chip test LD/LED/PD test optical fiber spectrum characteristics Test Material/device IV/CV characteristics test Hall test electromagnetic transport characteristics high frequency characteristics test, etc.


SCG launched series is the first domestic company independent research and development of high and low temperature vacuum prober, the equipment by Harbin Institute of Technology in 2016 to participate in and China aerospace science and technology group, to build the space environment of ground simulation device part of the core project design of the project, in turn, ultra high vacuum, automatic control, laser simulation plays a SEMISHARE unique technical advantages, is an innovative SEMISHARE technology accumulated for years.


03

ThreeInone™ technology

ThreeInone technology is to provide a kind of probe bench with high stability performance and semi-automatic wafer testing equipment. Through the stable structure of probe bench with low center of gravity, the problem that the equipment is easy to shake and affect the test accuracy in wafer testing is solved. Finally, the work of probe bench with high stability performance is guaranteed to make the test reach high precision.



(Three ZOOM) 3-fold imaging system

SEMISHARE 3 ZOOM patent microscope, the industry's unique multi-field tripling with the same focal optical path system, optical 120X 2000X magnification, size multi-field display at the same time, can make the point needle more convenient operation;It can be used with semi-automatic X series probe bench to meet the testing requirements of wafer and various devices, with high compatibility and significantly improving the testing efficiency.


Application direction: Various kinds of devices Wafer et al conduct characteristics analysis of I-V C-V optical signal RF 1/ F noise, etc., RF test, high-power Wafer test, etc.


X series is currently the fastest test run in the industry (& GT;70mm/s) is a semi-automatic wafer probe platform with the highest test accuracy (1 m). It is specialized in testing the performance of various advanced chips and integrates various functions such as electric light wave and microwave. Meanwhile, it has the highest temperature wide area (-60-300) in the industry, which can match various test application environments and effectively improve the test efficiency by over 40%.Equipped with rich software testing functions, it provides excellent reliability testing for all kinds of advanced wafer devices, greatly improving the technological level and yield rate of tested products.

04

High-Performance™ technology

High-performance technology provides a highly stable fully automatic wafer probe table and fully automatic wafer test equipment. Through the multi-reinforcement stable structure of fully automatic wafer probe table, it solves the problem that the equipment is easy to shake during wafer test and affects the test accuracy, thus ensuring the motion stability and precision of the probe table during wafer test.


Application direction: Wafer testing, all kinds of devices, Wafer, etc., for i-V, C-V, optical signal, RF, 1/ F noise and other characteristics analysis, RF testing, etc.


A series is the first high-end domestic independent research and development production of fully automatic production prober, the probe station has high testing precision and super fast test speed, the world first-class temperature control system, has automatic up-down material, automatic wafer alignment, automatic wafer center, automatic test diesize, etc, has the identification function of wafer ID at the same time, can be A single point test can also be continuous testing, test software feature-rich, while to ensure that the test precision has high testing speed, heavily for the enterprise to gain test speed, greatly improve the productivity and efficiency.

SEMISHARE advanced wafer probe technology has been widely used in the semiconductor industry panel industry research institutes and universities more than 1000 domestic customers, help the industry application, promote the overall development of the semiconductor industry in China.




© 2023 SEMISHARE CO., LTD. All Rights Reserved.粤ICP备19119103号