Product Overview
SEMISHARE CGX semi-automatic vacuum high-low temperature probe station is designed for research and specific production applications. It enables rapid and high-precision testing on single wafers in a vacuum environment, temperature range:77K-450K(liquid nitrogen), 10K-450K(liquid helium).
Basic Information
| Product number | CGX8 | working environment | Vacuum High-Low Temperature Environment |
| electricity demand | AC220V,50~60HZ | Control method | Semi-Automatic |
| Product Size | 1150*1450*1800mm | equipment weight | About 1000KG |
Application direction
Based on sample classification: Wafer Testing，LED Testing，Power Device Testing，MEMS Testing，PCB Testing ，LiquidDisplay Panel Testing，Solar Cell Panel Testing，Surface Resistivity Testing. Based on application classification: RF Testing，High-Temperature Environment Testing，Low Current (100fA Level) Testing，I-V/C-V/P-IV Testing，High Voltage, High Current Testing，Magnetic Field Environment Testing，Radiation Environment Testing.
Technical characteristics
Independent research and development of software integration system, more compatibility
●Supports semi-automatic control (manual or automatic testing)
●Automatic wafer calibration, wafer mapping, die size measurement, alignment, and remote access to test data
●One-click automatic calibration of RF probe module, with automatic probe cleaning function
●One-click adaptive four-axis Chuck precision calibration, supporting micrometer-level pad point testing
●Supports single-point or continuous testing
●Strong data storage and processing capabilities
●Ability to divide test results into BIN values and identify NG devices
●Multiple system integration capabilities, allowing independent upgrades of operating systems, application systems, and device testing systems
Air film shock absorption system
The industry's unique internal integration of high-performance air film shock absorption system and the dual design of the external isolation barrier, effectively avoid the vibration caused by the operator's touch;In addition, a long-aging casting is used as the substrate to suppress the vibration in the process of motion at the fastest speed of 1S in the industry to ensure the stable operation of the equipment, and to ensure that the screen does not shake when the image is enlarged at 2000X;At the same time, the high-precision control valve ensures that the height error of the moving part of the platform is 0.1mm, effectively realizing the test ability of fast die to die, ensuring that the whole system can still maintain a stable running state when moving at a high speed, and greatly improving the test efficiency.
Industry leading 3 times imaging technology
12:1 fast and precise motorized zoom microscope, zoom range 0.6~7.2X, image resolution 3.05μm, total magnification range 33X~396X.
The industry's most efficient CHUCK system, test efficiency significantly improved
● High efficient CHUCK test system，running speed≥40mm/s, motion precision≤±1μm , while moving the translocation time index time 500ms, excellent system operating parameters have reached the highest level of the industry, ultra-high test accuracy and efficiency to meet all kinds of wafers and devices of high repeatability and stability test, test efficiency significantly improved
●Temperature control accuracy and stability better than ±0.1℃, providing reliability wafer testing in high and low temperature environments
●The compact structure design of four-dimensional motion with low center of gravity ensures the motion speed of 40mm/s while maintaining the stability of motion acceleration and deceleration
