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Product Overview Functional structure Specifications Download
Mask Cut Repair L14

Product Overview

The L14 series mask laser cutting and repair equipment is mainly used to repair defects that occur during the use of photomasks. At the core of the device is SEMISHARE's advanced machine vision system, which provides a high-precision, cost-effective repair solution for high-value photomask defects that helps companies lower production and operational costs.

Basic Information

Product number L14 working environment Open Type
electricity demand AC 220V ±5% 50Hz Control method Manual
Product Size Customizable equipment weight Customizable

Application direction

Application scenarios that require precise cutting or removal of specific material layers.

Technical characteristics

Mask Cut Repair L14

●It can handle the repair of various materials including chromium, silicon, silicon nitride, quartz, EUV materials, foreign particles and stubborn unknown particles.
●It can precisely remove or repair defective areas without affecting other parts of the mask.
●It can provide customized products according to customer needs.

Title

Stage

Size

500mm*320mm

X-Y Travel

8*8 inches

Sample Fixing Method

natural placement

Light Source

backlight, upper light source

Microscope Characteristics

Travel

mirror body fixed, Z-axis travel: 50mm

CCD Pixel

50W(analog)/200W(digital)/500W(digital)

Eyepiece

10X eyepiece

Objective Lens

5X, 10X, 20X, 50X (optional), 100X (optional)

Objective Lens Turntable

manual nose wheel

Laser Characteristics

Wavelength

optional wavelength: 1064/532/355/266nm band

Energy

output power: 2.2mJ/pulse

Micromachining Capability

machinable materials: Cr/Al/ITO/Ni/TFT/RGB/Poly Silicon/Mo/SiN/mpurities in CF, etc.

Processing Accuracy

minimum process accuracy 1*1μm (when equipped with 100X lens)

Cooling Method

air-cooled laser/water-cooled laser


Customer Service
Request for quotation Request for quotation
Contact number

Contact number

0755-2690 6952 turn 801/804/806/814

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