Product Overview
A Basics type based on the university education and laboratory test wafer prober, this equipment is mainly applied in the semiconductor industry, as well as test of the photoelectric industry, including research and development of precision electrical measurement of complex high-speed device, the chip and LD/LED/PD tests, PCB/packaging device testing, rf testing 50 microns electrode/PAD test materials/components/CV IV characteristic test, etc.
Basic Information
| Product number | M4、M6、M8 | working environment | Open type |
| electricity demand | 220V,50~60Hz | Control method | Manual probe station |
| Product Size | M4、M6：650*490*620mm M8：766*500*651mm | equipment weight | M4：about 45kg M6：about 52kg M8：about 90kg |
Application direction
This equipment is mainly used for testing in semiconductor and optoelectronic industries, including r&d chip and LD/LED/PD test of complex high-speed devices,PCB/ package device test, AND IV/CV characteristic test of electrode /PAD test material/device over 50 microns.
Technical characteristics
> New upgraded chuck mobile platform
Enclosed mobile platform design, dustproof, error-proof operation, beautiful structure. The moving platform adopts THK precision lead screw drive + linear movement + no clearance return trip difference design + chuck locking function to improve chuck moving precision in many aspects.
> Chuck with 3-stage vacuum adsorption control
The central vacuum adsorption hole and 3-ring vacuum adsorption ring are used to fix the sample. Each vacuum channel of the chuck can independently control the central adsorption hole of the standard chuck to be 1mm in diameter. The chuck Angle can be rotated 360 and the precision of micro-rotation can be adjusted to 0.002 according to the requirements of customers, which is convenient to adjust the position of the sample to be tested.
> POMater™ Adaptive shock absorbing base
The self-adaptive shock-absorbing base is designed with imported shock-absorbing materials from Germany to enhance elastic support, to achieve different degrees of rigidity, hardness and bearing range, and effectively filter vibration source interference in the environment to ensure stable contact between the probe end and the Pad of the sample, improving the stability of the test.
