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Probe Station Temperature Chuck / Vacuum Wafer Chuck | SEMISHARE

SEMISHARE manufactures cutting-edge probe station temperature chucks and vacuum wafer chuck for wafer testing to address extreme temperature environment challenges.

SEMISHARE: Pioneering Advanced Probe Station Chuck Technology for Semiconductor Testing

In the rapidly evolving landscape of semiconductor technology, the demand for precise and reliable testing equipment has never been greater. At the heart of this critical process lies the probe station chuck, a fundamental component that ensures accurate and stable wafer positioning during testing. SEMISHARE, a leading innovator in semiconductor testing solutions, has established itself as a premier provider of cutting-edge probe station chucks, temperature chucks, and vacuum wafer chucks.

The Crucial Role of Probe Station Chucks in Semiconductor Testing

What is the purpose of a probe station?

A probe station serves as an essential platform for the electrical testing of semiconductor wafers and individual die. It facilitates the precise connection between the wafer's contact points and the test equipment, enabling accurate measurements and comprehensive analysis of semiconductor devices. The probe station chuck is a critical component of this system, providing the stable foundation necessary for reliable testing.

SEMISHARE's probe station chucks are engineered to meet the exacting demands of modern semiconductor testing. Our chucks offer unparalleled stability, temperature control, and compatibility with a wide range of probing systems, ensuring that our clients can perform tests with the utmost precision and confidence.

The probe station chuck is the cornerstone of effective semiconductor testing. It provides a stable platform for wafer positioning, ensuring that the delicate probes make precise contact with the wafer's test points. SEMISHARE's probe station chucks are designed with advanced features such as multi-zone temperature control and ultra-flat surfaces to maximize testing accuracy.

Understanding the Thermal Chuck: A Key to Temperature-Dependent Testing

What is a thermal chuck?

A thermal chuck, also known as a temperature chuck, is a specialized component designed to maintain specific temperature conditions during the testing process. This capability is crucial for evaluating the performance of semiconductor devices across various thermal environments, simulating real-world operating conditions.

SEMISHARE's temperature chucks are at the forefront of thermal control technology. Our high and low temperature chucks offer an impressive temperature range from -60°C to 300°C, allowing for comprehensive testing across extreme temperature conditions. This wide range enables our clients to thoroughly assess the thermal characteristics of their semiconductor devices, ensuring reliability and performance in diverse applications.

The temperature chuck plays a vital role in simulating real-world operating conditions for semiconductor devices. By precisely controlling the temperature of the wafer during testing, engineers can evaluate device performance under various thermal stress scenarios. SEMISHARE's temperature chucks feature advanced heating and cooling systems that provide rapid temperature changes and excellent temperature uniformity across the wafer surface.

The Versatility of Wafer Chucks in Semiconductor Testing

What is a wafer chuck?

A wafer chuck is a specialized device designed to securely hold and position semiconductor wafers during the testing process. It plays a vital role in ensuring the stability and precise alignment of the wafer, which is essential for accurate measurements and analysis.

SEMISHARE's wafer chucks are engineered for optimal performance and versatility. Our vacuum wafer chucks utilize advanced suction technology to provide a secure hold on wafers of various sizes, from small die to large 12-inch wafers. This adaptability makes our chucks suitable for a wide range of testing applications, from research and development to high-volume production environments.

The vacuum wafer chuck is a critical component in modern semiconductor testing setups. It uses a controlled vacuum to securely hold the wafer in place, ensuring stability during probing operations. SEMISHARE's vacuum wafer chucks feature multi-zone vacuum control, allowing for optimal wafer flatness and reducing the risk of wafer warpage during testing.

Mastering the Art of Probe Station Usage

How do you use a probe station?

Using a probe station effectively requires a combination of precision equipment and skilled operation. The process typically involves the following steps:


  1. Wafer Loading: Carefully place the wafer onto the probe station chuck.
  2. Chuck Alignment: Ensure the chuck is properly aligned with the probing system.
  3. Probe Positioning: Accurately position the probes to make contact with the wafer's test points.
  4. Testing: Perform the required electrical tests and measurements.
  5. Analysis: Interpret the test results to evaluate the device's performance.


SEMISHARE's probe station chucks are designed to streamline this process, offering features such as automated alignment, multi-area independent adsorption, and compatibility with a wide range of probing systems. These features enhance the efficiency and accuracy of the testing process, allowing our clients to achieve reliable results with greater ease.

The Critical Factor of Chuck Temperature Control

What temperature should a chuck be?

The ideal temperature for a probe station chuck depends on the specific testing requirements of the semiconductor device. Some tests require room temperature conditions, while others necessitate extreme hot or cold environments to simulate real-world operating conditions.

SEMISHARE's temperature chucks offer exceptional flexibility in this regard. Our normal temperature chucks provide stable room temperature conditions for standard testing, while our high and low temperature chucks can achieve temperatures ranging from -60°C to 300°C. This wide temperature range allows our clients to conduct comprehensive thermal testing, ensuring their devices meet performance specifications across various environmental conditions.

The Innovative Technology Behind Vacuum Chucks

What is a vacuum chuck used for?

A vacuum chuck utilizes suction to securely hold a wafer in place during testing. This technology is particularly useful for handling thin or fragile wafers that might be damaged by mechanical clamping methods.

What is the principle of vacuum chuck?

The principle of a vacuum chuck is based on creating a pressure differential between the chuck surface and the ambient environment. By removing air from beneath the wafer, the chuck creates a suction effect that holds the wafer firmly in place.

SEMISHARE's vacuum wafer chucks leverage this principle to provide superior wafer stability during testing. Our chucks feature multi-area independent adsorption, allowing for precise control over the vacuum distribution. This ensures even the most delicate wafers are held securely without risk of damage or distortion.

The Electrostatic vs. Vacuum Chuck Debate

What is the difference between electrostatic chuck and vacuum chuck?

While both electrostatic and vacuum chucks are used to secure wafers during testing, they operate on different principles:

1. Electrostatic Chuck: Uses electrostatic forces to hold the wafer in place.

2. Vacuum Chuck: Utilizes air pressure differential to create a suction effect.

SEMISHARE offers both types of chucks, recognizing that each has its advantages in different testing scenarios. Our vacuum wafer chucks are particularly well-suited for applications requiring quick wafer changes or when dealing with wafers that might be sensitive to electrostatic forces.

SEMISHARE's Innovative Probe Station Chuck Solutions

SEMISHARE's commitment to innovation is evident in our comprehensive range of probe station chucks:

1. High and Low Temperature High Voltage Chuck:


  • Temperature Range: -60°C to 300°C
  • Voltage Capability: Up to 10kV
  • Features: Kelvin triaxial type (M), 3kV or 10kV coaxial connection


2. Normal Temperature Chuck:


  • Multi-area independent adsorption
  • Three-stage vacuum adsorption
  • Compatible with coaxial, triaxial, RF, and high voltage applications


3. High and Low Temperature Chuck:


  • Temperature Range: -60°C to 200°C
  • Air-only operation - no liquids or Peltier elements required
  • Modular system for customized testing requirements


Each of these probe station chuck solutions is designed to meet the diverse needs of the semiconductor industry, from research and development to high-volume production testing.

Advanced Features of SEMISHARE's Probe Station Chucks

1. Precise Temperature Control: Our temperature chucks offer exceptional temperature stability and uniformity, crucial for accurate device characterization.

2. High Voltage Capability: SEMISHARE's high voltage chucks can handle up to 10kV, enabling testing of power semiconductor devices.

3. Multi-Zone Vacuum Control: Our vacuum wafer chucks feature independently controlled vacuum zones, ensuring optimal wafer flatness.

4. Rapid Temperature Transition: Advanced heating and cooling systems allow for quick temperature changes, increasing testing efficiency.

5. Customizable Chuck Surfaces: We offer various chuck surface materials to suit different testing requirements, including ceramic for high-frequency applications.

6. Integration with Automated Systems: Our chucks are designed for seamless integration with automated wafer handling systems, enhancing productivity in high-volume testing environments.

The SEMISHARE Advantage: Why Choose Our Probe Station Chucks?

1. Precision Engineering: Our chucks are designed and manufactured to the highest standards, ensuring unparalleled accuracy and reliability in semiconductor testing.

2. Temperature Versatility: With temperature ranges from -60°C to 300°C, our chucks can simulate a wide variety of operating conditions.

3. Compatibility: Our chucks are compatible with all major production probes and analytical probes, offering seamless integration into existing testing setups.

4. Customization: Our modular systems allow for customization to meet specific testing requirements, providing flexibility for diverse applications.

5. Innovation: Continuous investment in R&D ensures that our chuck technology remains at the cutting edge of the industry.

6. Reliability: Rigorous quality control measures guarantee the consistent performance of our chucks, even in demanding testing environments.

7. Expert Support: Our team of experienced engineers provides comprehensive support, from product selection to after-sales service.

Applications of SEMISHARE's Probe Station Chucks

1. Semiconductor Device Characterization: Our probe station chucks enable comprehensive electrical and thermal characterization of various semiconductor devices.

2. Wafer-Level Reliability Testing: The precise temperature control of our chucks allows for accelerated life testing and stress testing of semiconductor devices.

3. RF and Microwave Device Testing: SEMISHARE's chucks are optimized for high-frequency testing, with minimal signal loss and interference.

4. Power Device Testing: Our high voltage chucks are ideal for testing power semiconductors and high-power electronic devices.

5. MEMS Device Testing: The stability and precision of our chucks make them suitable for testing delicate MEMS (Micro-Electro-Mechanical Systems) devices.

6. Photonics Device Testing: Our chucks can be integrated with optical testing systems for characterization of photonics devices.

Future Developments in Probe Station Chuck Technology

At SEMISHARE, we are constantly pushing the boundaries of probe station chuck technology. Our ongoing research and development efforts focus on:


  1. Ultra-low temperature chucks for cryogenic testing applications.
  2. Advanced materials for improved thermal performance and stability.
  3. Integration of smart sensors for real-time monitoring and control of chuck conditions.
  4. Development of chucks for testing next-generation semiconductor materials and devices.


Advancing Semiconductor Testing with SEMISHARE

As the semiconductor industry continues to evolve, the need for precise, reliable, and versatile testing equipment becomes ever more critical. SEMISHARE's advanced probe station chucks, temperature chucks, and vacuum wafer chucks are at the forefront of this technological revolution, providing the tools necessary to ensure the quality and reliability of next-generation semiconductor devices.

Our commitment to innovation, quality, and customer satisfaction has established SEMISHARE as a trusted partner for semiconductor manufacturers, research institutions, and testing facilities worldwide. By choosing SEMISHARE's chuck solutions, you're not just investing in a product – you're investing in the future of semiconductor technology.

For more information about our probe station chucks, temperature chucks, vacuum wafer chucks, or to discuss your specific testing requirements, visit our website at https://www.semishareprober.com/. Alternatively, contact our sales team directly at 0755-2690 6952 (extensions 801/804/806/814) to explore how SEMISHARE can elevate your semiconductor testing capabilities.

Join us in shaping the future of semiconductor technology with SEMISHARE's advanced chuck solutions – where precision meets innovation, and reliability is standard.

Product OverviewDownloadVideo
Temperature Chuck

Standard/Sizes

High voltage probe holder HV-T-3KV

High voltage probe holder HV-T-3KV

Specification:Maximum test voltage: 3KV
Leakage flow (tip diameter 20um): 5pA/3000KV
Working temperature: -55℃~300℃
Interface: HV male (female)

Size:152*99*42mm

Features:1. Ultra-low leakage. 2. Easy to use and simple probe replacement. 3. Large height adjustable range.

Triaxial Probe Holder T2H/T2L

Triaxial Probe Holder T2H/T2L

Specification:Leakage (tip diameter 20um): 100fA/10V
Working temperature: -55℃~300℃
Interface: three-axis male (female)

Size:T2H:135*80*38mm
T2L:115*100*41mm

Features:1. Ultra-low leakage. 2. Easy to install.

Coaxial Probe Holder C2H/C2L

Coaxial Probe Holder C2H/C2L

Specification:Leakage (tip diameter 20um): 10pA/10V
Working temperature: -55℃~300℃
Interface: three-axis male (female)

Size:C2H:135*80*38mm
C2L:115*100*41mm

Features:1. Ultra-low leakage. 2. Easy to install.

Radio Frequency Adjusting Holder RF2

Radio Frequency Adjusting Holder RF2

Specification:Multi-point probe leveling knob, adjustable ±8°
Accuracy 0.1°
Wide travel range adjustment, the front and rear travel range is 40mm, and the up and down travel range is 22mm.

Size:Regular

Features:Mostly used for X series semi-automatic and C series high-low temperature probe stations

Radio Frequency Adjusting Holder RF3

Radio Frequency Adjusting Holder RF3

Specification:Multi-point probe leveling knob, adjustable ±8°
Accuracy 0.1°

Size:Regular

Features:Suitable for probe stations with octagonal box structure Mostly used for X series semi-automatic and C series high-low temperature probe stations High current, shunt probes available

GGB low-loss RF probe, GGB differential RF probe, TP RF probe, TPD differential RF probe

GGB low-loss RF probe, GGB differential RF probe, TP RF probe, TPD differential RF probe

Specification:DC power supply DC-40GHz to -145GHz optional
Tip configuration: GS/SG/GSG/GSSG/GSGSG, etc.
Tip distance: Different tip types are available in a wide range (such as GSG: 25~2450 μm)

Size:Regular

Features:The voltage waveform in the circuit is converted into a specific voltage value for accurate measurement and analysis.

ST Seires Hard needle

ST Seires Hard needle

Specification:ST

Size:Hard needle tungsten material

Features:ST series hard needles are made from 0.020 inch (0.51mm) diameter tungsten needles after electrochemically processing and they come with a length of 1.5inch (38.1mm).They are mostly used for the vast majority of chip electrode spot tests and circuit spot tests.ST series hard needles can be used to scrape or pierce the passive layer on the chip surface.They can be optionally plated with nickel on the surface. If you choose nickel plating, add "NP" after the model number.

Kelvin Probe

Kelvin Probe

Specification:Test frequency 150MHz
leakage<10fA
capacitance<10fF

Size:Regular

Features:Suitable for small signal testing. APT Kelvin Probe is suitable for four-wire method testing to reduce the impact of wire resistance and contact resistance on testing and ensure the accuracy of testing of small resistances. In addition, APT Kelvin Probe also can be used for high-frequency(such as 150Mhz) tests.

Large Current Shunt Probe

Large Current Shunt Probe

Specification:DC capability of a single shunt pin is 5A, pulse test capability of a single shunt pin is 50A

Size:number of needles can be customized

Features:Suitable for high current Testing and can better contact the sample

T-4 Series Soft Needle

T-4 Series Soft Needle

Specification:T-4

Size:soft needle

Features:T-4 series soft needles are mostly used for spot testing circuits and electrodes of integrated circuits, or mini electrodes made by FIB (focused ion beam). T-4 series soft needles are made of tungsten needles with different diameters which are welded to tin-plated copper needle bars. Among them, T-4-10 and T-4-22 show remarkable advantages over other models according to customer feedback, because their needle diameters are thin and have good bending elasticity, which can greatly reduce the damage to the chip electrode and ensure perfect contact with the electrode even under vibrating environment. T-4 soft pins are not recommended to be used in sensitive nodes because they will cause capacitive load problems and the high-impedance Picoprobes series are more adviseable to be used instead in such situation.

SS-700e-m

SS-700e-m

Motorised Micropositioner

Specification:XYZ stroke 15mm; movement resolution 0.1μm; repeat positioning accuracy ±1μm; maximum movement speed 10mm/s.

Size:146L x 125W x 140H mm; Weight: 1.97kg

Features:
●Quickly adjust the position manually;
●Compatible with a variety of manual probe fixtures;
● Conveniently expandable to support up to 4 motorised needle holders at the same time.

Air-floating automatic balance anti-vibration table

Air-floating automatic balance anti-vibration table

Specification:

Size:600*900*600mm

Features:The pneumatic support frame is designed and manufactured with a special two-chamber system design to ensure that the natural vibration frequency is kept low, excellent vibration isolation in both vertical and horizontal directions, and excellent damping with leveling valve design provides automatic leveling.

Adapter

Adapter

Coaxial female to banana male/coaxial female adapter Three-axis female to coaxial female/coaxial male/three-axis female adapter)

Specification:Maximum current: 10A
Maximum frequency: 500 MHZ
Minimum leakage current: 100fA
Maximum voltage: 1000V

Size:Regular

Features:You can contact our engineers for more details.

High and low temperature high voltage chuck

High and low temperature high voltage chuck

High-low-temperature and high-voltage three-axis groove chuck

Specification:-60°C to 200°C/-60°C to 300°C; 3KV/10KV

Size:8,12 inches

Features:
Kelvin triaxial type (M), 3kV or 10kV coaxial connection
500A pulse simultaneously meets test temperature requirements from -60°C to +300°C
It can ensure ultra-low leakage and avoid breakdown under high voltages up to 10,000 volts.

Normal temperature chuck

Normal temperature chuck

Room temperature porous chuck

Specification:Coaxial/Triaxial/RF/High Voltage

Size:4,6, 8,12 inches

Features:
Multi-area independent adsorption/three-stage vacuum adsorption
Modular system, customized to adapt to personalized testing requirements
Compatible with all major production probes and all major analytical probes
Offers complete hardware and software integration

High and low temperature chuck

High and low temperature chuck

High and low temperature three-axis groove chuck

Specification:-50/60℃ to 200℃

Size:8,12 inches

Features:
Without cooling machine, the temperature can be as low as -10℃
Air only - no liquids or Peltier elements
Modular system, customized to adapt to personalized testing requirements
No separate purge air source required
Compatible with all major production probes and all major analytical probes
Offers complete hardware and software integration

SS-125-M

SS-125-M

Submicron circuit/RF test Micropositioner

Specification:x-y-z travel direction:14 x 14 x 14mm; Linear motion; Lead screw precision:125 Thread / Inch; Movement accuracy<1 microns

Size:110mmL×51mmW×100mmH,1.1kg

Features:
The axis movement mode is changed from differential head lifting to screw drive, which avoids shaking after collision.
The tooth distance is shorter and the adjustment accuracy is higher.
The handles have different sizes, making the operation process easier to distinguish.

SS-100

SS-100

Submicron circuit/RF test Micropositioner

Specification:X-y-z travel direction;12 x 12x 12mm;Linear motion;Lead screw precision;100 Thread / Inch;Movement accuracy;0.7 microns

Size:115mm long *100mm wide *112mm high;About 1000 grams

Features:● Submicron process IC circuit testing; ● Linear, recoilless movement; ● It can be used with coaxial/triaxial probe fixture; ● The fixture can be tilted at a range of 30 degrees; ● Tungsten probes can be used; ● Rf pins can be configured in east/south/west/North directions; ● Rf test capability; ● DC to 40GHz~120GHz; ● Calibration chip and calibration software can be used together; ● Probe interface and cable connection 45 degrees, no L-type adapter; ● The probe can be removed for maintenance; ● Fixed device with RF test line.

SS-40-T

SS-40-T

Circuit/RF test pins

Specification:X-y-z travel direction;12 x 12x 12mm;Linear motion;Lead screw precision;40 Thread / Inch;Movement accuracy;2 microns

Size:64mm long *47mm wide *66mm high; About 200 grams

Features:● Linear movement; ●I/O Pad spot measurement; ● Circuit point measurement; ● Radio frequency test; ● Smaller volume; ● It can be used with coaxial/triaxial probe fixture.

SS-40

SS-40

I/O Pad/Electro-Optics Test needle holder

Specification:X-y-z travel direction;12 x 12x 12mm;Linear motion;Lead screw precision;40 Thread / Inch;Movement accuracy;10 microns

Size:64mm long *47mm wide *55mm high; About 175 grams

Features:● Affordable price; ● Linear movement; ●I/O Pad spot measurement; ● Point measurement of photoelectric devices; ● Smaller volume; ● It can be used with coaxial/triaxial probe fixture.

SS-700

SS-700

Submicron circuit/RF test Micropositioner

Specification:X-y-z travel direction;8 x 8 x 8mm;Linear motion;Lead screw precision;700 Thread / Inch;Movement accuracy;0.1 microns

Size:148mm long *120mm wide *140mm high; Weighs 1500 grams

Features:Submicron process IC circuit testing;Linear, recoilless movement;Can be used with coaxial/triaxial probe fixture;The fixture can be tilted at a range of 30 degrees;Tungsten probes can be used;Rf pins can be configured in four directions east/south/west/North;Rf testing capability;Dc to 40 GHZ ~ 120 GHZ;Calibration tablets and calibration software can be used together;45 degree connection between probe interface and cable, no L-type adaptor required;The probe can be removed for maintenance;Fixed device with RF test line.

Annex

For detailed specifications of the heating table, you can download our accessories manual.
Customer Service
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Contact number

Contact number

0755-2690 6952 turn 801/804/806/814

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